Wires & cables
Compatible grades
Clean HP®
Clean HP is a purging compound containing high level of additives (non-abrasive minerals and organic additives) and Polyethylene Metallocene as carrier. Is especially useful in extrusion applications. Is significantly reduces the cleaning time of the screw of the extruder. Is runs smoothly and can itself be easily removed from the extruder.
Processing temperatures
From 80°C to 230°C.
Clean LDPE®
Clean LDPE is a purging compound containing high level of additives (non abrasive minerals and organic additives) and Low Density Polyethylene (LDPE) as carrier. He is especially useful in extrusion applications. He significantly reduces the cleaning time of the screw of the extruder. He runs smoothly and can itself be easily removed from the extruder.
Processing temperatures
From 100°C to 200°C.
Clean HDPE®
CLEAN HDPE is a purging compound containing high level of additives (non abrasive minerals and organic additives) and High Density Polyethylene (HDPE) as carrier. He is especially useful in extrusion of profiles as well as in injection moulding. He significantly reduces the cleaning time of the screw of the extruder or the barrel of the injection moulding machine. He runs smoothly and can itself be easily removed from the extruder or moulding machine.
Processing temperatures
From 150°C to 270°C.
Real customer cases
WIRES & CABLES
Contact our team of purging compound experts to define together the purging grade you need as well as the right process to settle and adjust. Remember that beyond being a product range, Clean Xpress is the purging step, ensuring hybrid cleaning effects, playing with chemical affinity between the carrier and the material to purge, and finally implemeting the right procedure for your dedicated needs.